Semiconductor Packaging with Integrated Passive Componentry
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United States of America Patent
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Issued Date -
Sep 16, 2010
app pub date -
Mar 16, 2010
filing date -
Mar 16, 2009
priority date (Note) -
Abandoned
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Abstract
The invention provides advances in the arts with useful and novel integrated packaging having passive components included within packages also containing one or more ICs. The integrated passive components may include inductors, transformers, and capacitors, and are preferably constructed of leadframe materials. Typically, one or more magnetic field storage body is used in forming the coils in order to enhance the electrical performance characteristics of the passive component.
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