REDUCED OXIDATION SYSTEM FOR WIRE BONDING
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
May 27, 2010
filing date -
Apr 26, 2006
priority date (Note) -
Abandoned
status (Latency Note)
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Importance

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Non-US Coverage
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Abstract
A wire bonding machine is provided. The wire bonding machine includes (1) a bond site area for holding a semiconductor device during a wire bonding operation, and (2) a gas supply line configured to provide a gas at the bond site area from above the bond site area.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
KULICKE AND SOFFA INDUSTRIES INC | 1005 VIRGINIA DRIVE FORT WASHINGTON PA 19034 |
International Classification(s)

- 2010 Application Filing Year
- B23K Class
- 1150 Applications Filed
- 798 Patents Issued To-Date
- 69.40 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Frasch, E Walter | Perkasie, US | 9 | 52 |
# of filed Patents : 9 Total Citations : 52 | |||
Gillotti, Gary S | Lansdale, US | 18 | 207 |
# of filed Patents : 18 Total Citations : 207 | |||
Mak, Steven | Philadelphia, US | 3 | 47 |
# of filed Patents : 3 Total Citations : 47 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 5 Citation Count
- B23K Class
- 5.77 % this patent is cited more than
- 15 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

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