REDUCED OXIDATION SYSTEM FOR WIRE BONDING

Number of patents in Portfolio can not be more than 2000

United States of America Patent

SERIAL NO

12788827

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A wire bonding machine is provided. The wire bonding machine includes (1) a bond site area for holding a semiconductor device during a wire bonding operation, and (2) a gas supply line configured to provide a gas at the bond site area from above the bond site area.

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Patent Owner(s)

Patent OwnerAddress
KULICKE AND SOFFA INDUSTRIES INC1005 VIRGINIA DRIVE FORT WASHINGTON PA 19034

International Classification(s)

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  • 2010 Application Filing Year
  • B23K Class
  • 1150 Applications Filed
  • 798 Patents Issued To-Date
  • 69.40 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2010201120122013201420152016201720182019202020210255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Frasch, E Walter Perkasie, US 9 52
Gillotti, Gary S Lansdale, US 18 207
Mak, Steven Philadelphia, US 3 47

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Patent Citation Ranking

  • 5 Citation Count
  • B23K Class
  • 5.77 % this patent is cited more than
  • 15 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges28284904714833122301 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +020406080100120140160180200220240260280300

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