Polyamide Resin Composition for Portable Electronic Device and Molded Article for Portable Electronic Device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 9, 2010
app pub date -
Dec 19, 2006
filing date -
Jan 13, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Provided is a polyamide resin composition having particularly excellent strength and low warpage by virtue of being compounded with a glass fiber and suited as a material for portable electronic devices that are becoming thinner and lighter in weight in recent years.A polyamide resin composition for a portable electronic device, including (A) a polyamide resin, (B) a glass fiber having an elongated cross-section with an aspect ratio, defined by the formula shown below, of 2.5 or more, and optionally (C) a glass fiber having a circular cross-section with a diameter of 3 to 30 μm, wherein the ratio (by weight) of the component (B) to the component (c) is 3:7 to 10:0, wherein the proportion of the component (A) is 60 to 34% by weight, and the proportion of the component (B) or the proportion of the sum of the components (B) and (C) is 40 to 66% by weight with the proviso that the total sum of the above components is 100% by weight, and wherein the polyamide composition shows a tensile strength of 200 MPa or higher as measured for an ISO test piece thereof,Aspect ratio=(Major axis length D2 of the cross-section of the glass fiber)/(Minor axis length D1 of the cross-section of the glass fiber).
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully