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Abstract

Polymer compositions capable of a high degree of curing at relatively low temperatures, and prepregs, adhesives, films and composites formed therefrom are discussed. The polymer compositions include epoxy resin systems and a dual curing system including one or more curing agents containing one or more hydrazine-based curing agents having hydrazine functional groups and one or more amine-based curing agents containing one or more amine functional groups. The hydrazine-amine curing systems enable the polymer composition to achieve elevated levels of gelation or degree of cure at lower temperatures than are achievable with amine functional curing agents alone. Furthermore, this elevated degree of curing of the polymer composition may be achieved with substantially no reduction in tack life and/or out life of the prepreg, adhesive or film or cured state mechanical properties of composites, adhesives or other products fabricated therefrom, such as open hole compression strength and compressive strength after impact. The glass transition temperature of the cured polymer compositions is similarly unaffected.

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First Claim