DUAL OVENABLE FOOD PACKAGE HAVING A THERMOFORMABLE POLYESTER FILM LID
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 2, 2010
app pub date -
Aug 26, 2008
filing date -
Aug 30, 2007
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
The invention provides an ovenable vacuum skin package for storage and cooking of a food product. The package includes a receptacle and a thermoformable composite polymeric film cover heat-sealed thereto, and the composite polymeric film cover includes: (i) a thermoformable substrate layer comprising a first copolyester material; and (ii) on a surface of the substrate layer, a heat-sealable layer comprising a second copolyester material, the second copolyester material being different from the first copolyester material; wherein i. the receptacle comprises on a surface thereof a sealing region adapted to contact and form a scal with the heat-sealable layer; and ii. both the receptacle and the cover film comply with the requirements of paragraph h(1) of CFR §177.1630.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully