Moisture-proof device, moisture-proof IC, and method for increasing moisture-proof capability of IC
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United States of America Patent
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Issued Date -
Aug 26, 2010
app pub date -
Jan 20, 2010
filing date -
Feb 23, 2009
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Abandoned
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Abstract
Method for increasing the moisture-proof capability of a chip includes coating moisture-proof glue at the chink of the chip. More particularly, when the packaging structure carries a chink exposed to outside of the chip, the chink is coated with the moisture-proof glue for preventing moisture from entering the internal part of the chip so as to increase the moisture-proof capability of the chip.
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