METHOD AND MACHINE FOR EXAMINING WAFERS

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United States of America Patent

APP PUB NO 20100211202A1
SERIAL NO

12370913

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Abstract

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Method and machine utilizes the real-time recipe to examine a series of wafers during the fabrication of integrated circuits. Each real-time recipe essentially corresponds to a practical fabrication history of a wafer to be examined and/or the examination results of at least one examined wafer of same “lot”. Therefore, different wafers can be examined by using different recipes where each recipe corresponds to a specific condition of a wafer to be examined, even these wafers are received by a machine for examining at the same time.

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Patent Owner(s)

Patent OwnerAddress
HERMES MICROVISION INC7F NO 18 PUDING RD EAST DIST HSINCHU CITY 300

International Classification(s)

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  • 2009 Application Filing Year
  • G06F Class
  • 34869 Applications Filed
  • 24376 Patents Issued To-Date
  • 69.91 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2009201020112012201320142015201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHOU, CHIEN-HUNG SAN JOSE, US 42 826
TAI, WEN-TING FREMONT, US 2 2

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  • 2 Citation Count
  • G06F Class
  • 1.58 % this patent is cited more than
  • 15 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges90179011547494873422101831191027639901 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +01002003004005006007008009001000110012001300140015001600170018001900

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