POLISHING HEAD AND POLISHING APPARATUS
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United States of America Patent
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N/A
Issued Date -
Aug 19, 2010
app pub date -
Nov 20, 2007
filing date -
Nov 20, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention is a polishing head having at least: an approximately discoid mid plate; a rubber film covering at least a lower face portion and a side face portion of the mid plate; and a space portion surrounded by the mid plate and the rubber film; in which pressure of the space portion can be changed by a pressure adjustment mechanism, a back surface of a workpiece is held on a lower face portion of the rubber film and a front surface of the workpiece is brought into sliding contact with a polishing pad attached onto a turn table for performing polishing; wherein the mid plate and the rubber film do not contact one another to have a gap at least throughout a whole of the lower face portion of the mid plate. As a result, there is provided a polishing head etc by a rubber chuck method in which a uniform polishing load is applied over the workpiece without influence of stiffness or flatness of the mid plate.
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