POLYIMIDE FILMS COMPRISING FLUOROPOLYMER COATING AND METHODS
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United States of America Patent
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Issued Date -
Aug 19, 2010
app pub date -
Sep 5, 2008
filing date -
Sep 6, 2007
priority date (Note) -
Abandoned
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Abstract
A dielectric composite is provided that is useful for wrapping wire or cable or for supporting electronic circuitry. The composite comprises a polyimide layer having first and second major surfaces; a first fluoropolymer layer on the first major surface on the polyimide layer, said first fluoropolymer layer comprising at least about 55% PFA; and a second fluoropolymer layer on the second major surface on the polyimide layer, said second fluoropolymer layer comprising at least about 55% PFA. Protected wire or cable using the composite, and methods are also described.
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