PRINTED CIRCUIT BOARD UNIT
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United States of America Patent
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N/A
Issued Date -
Aug 19, 2010
app pub date -
Jun 26, 2009
filing date -
Feb 18, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A printed circuit board unit includes a substrate and at least one connecting pad on the substrate. The connecting pad is used for electrically connecting to an electronic device by welding method. The connecting pad has at least one venting opening thereon. Therefore, the steam and gas by-produced in reflow soldering process can escape into the environment from the venting opening. Accordingly, the problem of large bubbles formed in the connecting pads is solved.
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