Importance

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Abstract

Provided are a heat spreader for a semiconductor device, which can be joined such that a multitude of pin-shaped fins are not easily fractured even when the heat spreader for a semiconductor device is incorporated in a heat dissipation structure for a semiconductor device, in which direct cooling is performed by using water, and a method for manufacturing the heat spreader for a semiconductor device. The heat spreader (1) for a semiconductor device comprises: a plurality of columnar members (13) joined onto at least one of surfaces of a plate-like member (11, 12) by stud welding; and a joining layer (14) formed between the plate-like member (11, 12) and the columnar members (13). The plate-like member (11, 12) includes a base material (11) and surface layers (12). The surface layers (12) and the columnar members (13) are made of a material containing aluminum or an aluminum alloy. A thickness of the plate-like member (11, 12) is 0.5 mm through 6 mm and a thickness of each of the surface layers (12) is 0.1 mm through 1 mm. The joining layer (14) has a joining interface (15) on a boundary with the plate-like member (11, 12). A proportion of an area of the joining interface (15) being present in the surface layer (12) is greater than or equal to 50% and less than or equal to 100%, converted in terms of a plane projected to the one of the surfaces of the plate-like member.

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First Claim