METHOD OF MANUFACTURING ELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
Aug 12, 2010
app pub date -
Sep 5, 2008
filing date -
Sep 11, 2007
priority date (Note) -
Abandoned
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Abstract
An object of this invention is to provide a method for manufacturing an electronic device wherein a conductor layer is uniformly formed on a substrate having a super large area. In the method for manufacturing the electronic device, a metal film for forming a gate electrode is selectively embedded in a transparent resin film formed on a substrate, and the metal film is formed by sputtering directly on the substrate at the gate electrode portion, and on an insulating coat film on portions other than the gate electrode portion. The metal film on the insulating coat film is removed by chemical liftoff with removal of the insulating coat film by etching.
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