PHOTOELECTRIC SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Aug 12, 2010
app pub date -
Aug 27, 2009
filing date -
Feb 9, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A photoelectric semiconductor device has a metal wiring layer packed or embedded into a housing for enhancing package stability and electric connectivity. The housing has a cavity structure, and at least one LED chip and an encapsulating material are configured inside the cavity structure. The metal wiring layer locates inside the housing, or in other words, between the top surface and the bottom surface of the housing, and extends to the bottom of the cavity structure to electrically connect the LED chip. With fully wrapping around, the metal wiring layer has higher stability and more reliability from being harmed by outside changes in humidity and temperature.
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