SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Aug 12, 2010
app pub date -
Jan 15, 2010
filing date -
Feb 10, 2009
priority date (Note) -
Abandoned
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Abstract
A method for manufacturing a semiconductor device includes: (a) performing an inspection using an evaluation element formed on a scribe line of a semiconductor wafer; (b) marking a character on the semiconductor wafer, the character representing information based on a result obtained in step (a); and (c) performing a step subsequent to step (b) while using the information represented by the character marked in step (b).
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