SOLDERING APPARATUS
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United States of America Patent
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N/A
Issued Date -
Aug 12, 2010
app pub date -
May 30, 2007
filing date -
May 30, 2006
priority date (Note) -
Abandoned
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Abstract
is provided at the lower end of the jacket for gas to flow into or out of the spiral pathway so that the pathway can be purged of air when solder is not flowing through the pathway.
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