Adhesive bonding method
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United States of America Patent
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Issued Date -
Aug 12, 2010
app pub date -
Jul 23, 2009
filing date -
Feb 6, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides an adhesive bonding method including: providing a first component and a second component to be bonded and an adhesive; positioning the adhesive between the first component and the second component with the adhesive contacting with the first component and the second component; providing at least one light concentrator; and providing a light source and making at least partial light beams of the light source pass through the light concentrator and the first component in order, and then irradiate on the adhesive to cure the adhesive so as to bond the first component and the second component. The adhesive bonding method of the instant invention can maintain the alignment precision between the components being bonded so as to optimize products' performances. The invention also provides a plate installing device with a light concentrator, which can be installed by the adhesive bonding method above mentioned.
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