Electronics device module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8369099
APP PUB NO 20100195300A1
SERIAL NO

12656451

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed is an electronic device module including a module substrate having first and second electronic device pair portions. The first electronic device pair portion may include a first and a second contact pad area and a first via area between the first and second contact pad areas. The first electronic device pair portion may also include a first layer and a second layer. The first layer may include a plurality of first lines connecting a plurality of contact pads in the first contact pad area on one side of the module substrate to a plurality of vias. The second layer may include a plurality of second lines connecting a plurality of contact pads in the second contact pad area to a plurality of vias in the via area. The second layer may also include a plurality of third lines connecting the first and second electronic device pair portions.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI GYEONGGI-DO 443-742

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Do Hyung Yongin-si, KR 279 5496
Park, In-Young Anyang-si, KR 3 46
Seo, Dong-Yoon Yongin-si, KR 4 16
Yang, Jung-Mo Gwangmyeong-si, KR 2 16
Yoo, Hyun Jung Seoul, KR 3 10

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