METHOD OF REAR SURFACE TREATMENT, ANALYSIS METHOD OF INTEGRATED CIRCUIT FROM REAR SURFACE SIDE, AND REAR SURFACE TREATMENT APPARATUS

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United States of America Patent

APP PUB NO 20100193374A1
SERIAL NO

12700905

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Abstract

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A method of rear surface treatment is carried out by: preparing a semiconductor or device in which an integrated circuit having a plurality of electrodes is provided on the front surface of a semiconductor substrate; electrically con netting the plurality of electrodes to an anode; and electropolishing the rear surface of the semiconductor substrate by performing anodic oxidation with an electrolytic solution placed in contact with the rear surface of the semiconductor substrate.

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Patent Owner(s)

Patent OwnerAddress
NEC ELECTRONICS CORPORATIONKAWASAKI KANAGAWA 211-8668

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KITAHATA, Hideki Kanagawa, JP 9 95

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