THERMAL-IMPRINTING RESIN, THERMAL-IMPRINTING-RESIN SOLUTION, THERMAL-IMPRINTING INJECTION-MOLDED BODY, THERMAL-IMPRINTING THIN FILM AND PRODUCTION METHOD THEREOF

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United States of America Patent

APP PUB NO 20100189985A1
SERIAL NO

12667345

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Abstract

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There are provided a thermal-imprinting resin which has a good heat-deterioration tolerability and a low resin elastic modulus at the time of fluidization in order to suppress any production of particle-like materials in microfabrication by thermal imprinting, and has a good fine-pattern transfer characteristic, a thermal-imprinting-resin solution using the same, a thermal-imprinting injection-molded body using the same, a thermal-imprinting thin film using the same and a production method thereof. The thermal-imprinting resin has an exothermic onset temperature (oxidation onset temperature) of an exothermic peak due to oxidation greater than or equal to +35° C. to the glass transition temperature of the resin in differential scanning calorimetric measurement at a temperature rise rate of 5° C./min in air, and has a complex modulus less than 0.24 MPa at the glass transition temperature of the resin +35° C. in a dynamic viscoelastic modulus measurement at a frequency of 1 rad/sec in nitrogen stream. The thermal-imprinting-resin solution, the thermal-imprinting injection-molded body, the thermal-imprinting thin film and the production method thereof use the foregoing resin.

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Patent Owner(s)

Patent OwnerAddress
MARUZEN PETROCHEMICAL CO LTDTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kusuura, Takahisa Kanagawa, JP 67 290
Mitra, Anupam Tokyo, JP 23 27
Satsuka, Takuro Chiba, JP 7 22
Takaya, Yoshiaki Chiba, JP 16 35

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