Memory cooling device
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United States of America Patent
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N/A
Issued Date -
Jul 29, 2010
app pub date -
Jul 5, 2007
filing date -
Jul 5, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A memory cooling device includes a left clamping seat and a right clamping seat that clamp at least one heat pipe. At least one side of the heat pipe is a straight surface which is affixed with a clamping surface of the left clamping seat or the right clamping seat through a thermal adhesive, and another surface of the thermal adhesive is affixed on a bottom surface of the memory, such that operating temperature generated by the working memory can be directly transmitted to the heat pipe and the left and right clamping seats through the thermal adhesive, to increase the heat dissipation efficiency for the memory, and actually and effectively dissipate the heat, thereby improving a lifetime of usage of the memory.
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