INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME
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United States of America Patent
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Issued Date -
Jul 29, 2010
app pub date -
Oct 13, 2009
filing date -
Jan 26, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Aspects of the invention are directed towards an integrated circuit package and method of forming the same, and more particularly to a redistributed chip packaging for an integrated circuit. The integrated circuit package includes an integrated circuit having a protective material on at least a portion of the integrated circuit. A lead frame is coupled to the integrated circuit and a conductive layer is also coupled to the interconnect. A solder ball is coupled to the conductive layer and a passivation layer is on the conductive layer. Active and passive components are electrically coupled to the integrated circuit.
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