POLYAMIDEIMIDE RESIN FOR FLEXIBLE PRINTED CIRCUIT BOARDS; METAL-CLAD LAMINATE, COVERLAY, AND FLEXIBLE PRINTED CIRCUIT BOARD THAT USE THIS RESIN; AND RESIN COMPOSITION
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United States of America Patent
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app pub date -
Mar 31, 2010
filing date -
Jan 18, 2006
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Abstract
The present invention provides a polyamideimide resin for flexible printed circuit boards that prior to curing exhibits an excellent solubility, processability, and handling characteristics, and that after curing exhibits flame retardancy, solder heat resistance, circuit embeddability, and flexibility and further has a high glass-transition temperature and is able to maintain a high adhesive strength. The present invention provides a polyamideimide resin for flexible printed circuit boards, which is obtained by the polymerization reaction of an acid component comprising at least a monoanhydride and an aromatic dicarboxylic acid with a diisocyanate compound or diamine compound in an approximately equimolar amount with respect to the total molar amount of the acid component, wherein the molar amount of the monoanhydride is 0.4 to 0.8 taking the total molar amount of the acid component as 1.
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