CONDUCTIVE BUMPS, WIRE LOOPS INCLUDING THE IMPROVED CONDUCTIVE BUMPS, AND METHODS OF FORMING THE SAME
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app pub date -
Oct 18, 2006
filing date -
Oct 18, 2006
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Abstract
A method of forming a conductive bump using a wire-bonding machine is provided. The method includes (a) depositing a free air ball bump on a contact pad of a semiconductor element, (b) forming a first fold of wire on the deposited free air ball bump, and (c) forming a second fold of wire on the first fold of wire.
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