LOOP HEAT PIPE TYPE HEAT TRANSFER DEVICE
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United States of America Patent
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Issued Date -
Jul 29, 2010
app pub date -
Jun 11, 2008
filing date -
Jun 15, 2007
priority date (Note) -
Abandoned
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Abstract
It is an object of the invention to provide a loop heat pipe type heat transfer device that has reduced size, thickness and weight and exhibits high heat transfer performance. The loop heat pipe type heat transfer device is provided with an evaporator, a steam pipe that conducts a gas phase working fluid from the evaporator, a condenser connected to the steam pipe and a fluid pipe that circulates the liquid phase working fluid from the condenser to the evaporator, and is characterized in that a wick composed of a fiber structure laminate comprising a laminated nonwoven fabric is set inside the evaporator.
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