CLEANING METHOD AND SUBSTRATE PROCESSING APPARATUS
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United States of America Patent
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Issued Date -
Jul 29, 2010
app pub date -
Sep 9, 2008
filing date -
Sep 19, 2007
priority date (Note) -
Abandoned
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Abstract
Provided is a cleaning method for removing a film adhered inside a processing chamber of a substrate processing apparatus used for forming a desired film on a substrate by supplying a material gas for film formation. The method is provided with a step of supplying a halogen containing gas into the processing chamber, and a step of supplying a fluorine containing gas into the processing chamber while supplying the halogen containing gas, after starting to supply the halogen containing gas. In the step of supplying the fluorine containing gas, a supply flow volume ratio of the halogen containing gas to the entire gas supplied into the processing chamber is within a range of 20-25%.
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