EPOXY RESIN COMPOSITION
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United States of America Patent
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Issued Date -
Jul 22, 2010
app pub date -
Jun 12, 2008
filing date -
Jul 24, 2007
priority date (Note) -
Abandoned
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Abstract
An epoxy resin composition comprising, containing a solid epoxy resin (A) whose aromatic ring containing ratio is 5-40% obtained by reacting a polyester compound (b) possessing 1.2-1.8 of carboxylic group with a divalent epoxy resin (a) whose epoxy equivalent is 120-350 g/eq and a crosslinking agent (B) as essential components, and since a cured product obtained by curing said composition is superior in heat resistance, humid resistance and cracking resistance, said composition is useful in a field of electron material such as photo semi conductor sealing material, in particular useful for LED sealing.
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