PROGRAMMING AND CIRCUIT TOPOLOGIES FOR PROGRAMMABLE VIAS
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United States of America Patent
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Issued Date -
Jul 22, 2010
app pub date -
Mar 26, 2010
filing date -
Mar 13, 2007
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Abandoned
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Abstract
A semiconductor device may be created using multiple metal layers and a layer including programmable vias that may be used to form various patterns of interconnections among segments of metal layers. The programmable vias may be formed of materials whose resistance is changeable between a high-resistance state and a low-resistance state.
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