METHOD OF PRODUCING THIN LAYERS OF A SILICON, AND THIN SILICON
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United States of America Patent
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Issued Date -
Jul 15, 2010
app pub date -
Jun 18, 2007
filing date -
Jun 21, 2006
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Abandoned
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Abstract
The invention relates to a method for producing thin layers (3) of a silicon that can be subjected to plastic treatment, whereby the silicon layer (3) is extruded, and to the thin silicon layer produced by said method.
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