LASER DEVICE AND HEAT SINK WITH CORE TO MANAGE STRESS DUE TO THERMAL EXPANSION
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United States of America Patent
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Issued Date -
Jul 15, 2010
app pub date -
Jan 9, 2009
filing date -
Jan 9, 2009
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Abstract
A laser module comprising a laser device attached to a heat sink that is configured to provide a relatively low thermal resistance for thermal management of the laser device, and an aggregate coefficient of thermal expansion (CTE) that is substantially matched to the CTE of the laser device for reducing stress caused by thermal cycles. The heat sink includes a shell made out of a first material, and a core situated within the shell and made out of a second material distinct from the first material of the shell. By properly selecting the first and second materials, configuring the thickness of the shell directly under the location to which the laser device will be attached with respect to the thickness of the core, the desired effective or aggregate CTE and thermal resistance of the heat sink may be achieved.
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