MICROCHANNEL CHIP
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United States of America Patent
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Issued Date -
Jul 1, 2010
app pub date -
Dec 23, 2009
filing date -
Dec 26, 2008
priority date (Note) -
Abandoned
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Abstract
A micro-channel chip comprising a first substrate and a second substrate bonded together, characterized in that at least one patch of a non-adhesive thin-film layer for generating a micro-channel is formed on the mating surface of at least one of the two substrates, a port that is open to the atmosphere is provided in the first substrate, and at least one end portion of the non-adhesive thin-film layer is communicably connected to the port, further characterized in that an underplate made of a material that is difficult to deform by itself is provided on the underside of the second substrate, the underplate has a recess at the interface with the second substrate that extends from a position that is short of the center of the port toward the non-adhesive thin-film layer, and the width of the recess is greater than that of the non-adhesive thin-film layer.
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