SOLDER BATH AND METHOD OF HEATING SOLDER CONTAINED IN THE SOLDER BATH
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United States of America Patent
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Issued Date -
Jul 1, 2010
app pub date -
Dec 23, 2009
filing date -
Dec 27, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A solder bath contains a solder bath main body that contains solder, and a heating member that heats the solder. The heating member is mounted on outer surfaces of a bottom and sides of the solder bath main body. The heating member contains a thermal diffusion member that is made of stainless steel, which is mounted on the outer surfaces of a bottom and sides of the solder bath main body, a porous heat insulator that is mounted on and attached to the thermal diffusion member, and a heating element that is buried in the porous heat insulator. The heating element is also away from the thermal diffusion member.
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