Resin Composition, Electronic Component using the Same and Production Method Therefor
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United States of America Patent
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Issued Date -
Jun 24, 2010
app pub date -
Dec 17, 2009
filing date -
Dec 19, 2008
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Abandoned
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Abstract
Disclosed is a resin composition, which comprises a thermosetting resin contained therein in an amount of 40 volume % or more, and a wax contained therein in an amount of 5 to 30 volume %, wherein: the thermosetting resin exists in liquid form at room temperature; and the wax exists in powder form at room temperature and has a melting point of 70 to 150° C., and wherein the resin composition has a viscosity of 50000 to 150000 mPa·s as measured at room temperature.
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