Wire bonding method
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United States of America Patent
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app pub date -
Feb 22, 2010
filing date -
Feb 24, 2005
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Abstract
A wire bonding method for bonding a ball which is formed at a tip end of a bonding wire to a pad that is a first bonding point to form a first bonding part and bonding the wire to an interconnect wiring that is a second bonding point to form a second bonding part, thus connecting the pad and the interconnect wiring with the wire, wherein after the ball is bonded to the first bonding point and a capillary is ascended, examination is performed to find any bonding failure of the first bonding part; and when the bonding failure at the first bonding point is found, then the capillary is caused to descend to execute rebonding to bond the first bonding part to the first bonding point with applying greater energy comprising a longer period of bonding time than last first bonding while pressing the capillary to the first bonding point.
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