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Abstract

The invention provides a resin composition for stereolithography, which is low in absorption of water and moisture even when the composition is preserved for a long time, which is capable of maintaining high curing sensitivity for long, which is capable of fabricating a three-dimensional object in a shortened molding time, smoothly and in high productivity, the three-dimensional object being excellent in molding accuracy, dimensional accuracy, water resistance, moisture resistance, and mechanical characteristics.A resin composition for stereolithography (i) includes: an epoxy compound (A); an ethylenic unsaturated compound (B); a photo initiator for cationic polymerization (C); a photo initiator for radical polymerization (D); and an oxetane compound (E), (ii) an epoxy compound containing an alicyclic diglycidyl ether compound is included as the epoxy compound (A) in a proportion of 20 to 100 weight % with respect to a total weight of the epoxy compound (A), the alicyclic diglycidyl ether compound being represented by formula (I):represents a hydrogenated bisphenol A residue, a hydrogenated bisphenol F residue, a hydrogenated bisphenol Z residue, a cyclohexanedimethanol residue, or a tricyclodecanedimethanol residue, and (iii) an oxetane compound containing: a monooxetane compound (E1) having one oxetane group in a molecule thereof; and a polyoxetane compound (E2) having two or more oxetane groups in a molecule thereof is included as the oxetane compound (E) in a weight ratio of the monooxetane compound (E1) to the polyoxetane compound (E2) of 95:5 to 5:95.

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First Claim