Substrate carrier with enhanced temperature uniformity
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United States of America Patent
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Issued Date -
Jun 17, 2010
app pub date -
Dec 17, 2008
filing date -
Dec 17, 2008
priority date (Note) -
Abandoned
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Abstract
A substrate carrier is used in an in-line fabrication such as Plasma Enhanced Chemical Vapor Deposition (PECVD) for application of thin film on substrates. The carrier is in thermal communication with the substrate and thereby provides heat sinking. The carrier further permits movement of the substrate past a deposition apparatus at a deposition station.
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