HIGH-FREQUENCY COMPONENT HAVING LOW DIELECTRIC LOSSES
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United States of America Patent
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Issued Date -
Jun 17, 2010
app pub date -
Apr 25, 2008
filing date -
Apr 25, 2007
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a high-frequency component with an internal conductor structure (2) which is electrically insulated by at least one insulation element (4, 5) relative to an external conductor, wherein the insulation element (4, 5) mechanically supports the internal conductor structure (2). The insulation element (4, 5) consists of a film (10) shaped to a three-dimensional structure and hardened with this three-dimensional structure by sintering, which film is a film of an electrically insulating material with a wall thickness which is smaller than a thickness of the insulation element (4, 5) realised by the three-dimensional structure. The insulation element of the proposed high-frequency component can be produced inexpensively and leads to a lower insertion loss for the component compared to components made from solid insulation elements.
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