Heat-dissipating fin

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20100147493A1
SERIAL NO

12379900

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Abstract

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A heat-dissipating fin includes a sheety main body. The main body is provided with a high-temperature area located at each of two sides thereof, an airflow area located at a midsection thereof for an external airflow to pass through, at least one guide wall formed at the airflow area and having a front end facing the main body, and two inclined guide portions each extending rearward toward one side thereof from a front end thereof. In this way, the external airflow can be guided to the high-temperature areas of the fin to reach greater heat-dissipating efficiency.

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Patent Owner(s)

Patent OwnerAddress
TAI-SOL ELECTRONICS CO LTD3F NO 302 RUEIGUANG RD NEIHU DISTRICT TAIPEI CITY 114

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Jun Sichuan, CN 912 6715
Dai, Yue-Ping Jiangsu, CN 2 6
Ko, Meng Hung Taipei County, TW 1 4

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