Paste Composition for Forming Heat-Resistant Conductive Patterns on Substrate
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United States of America Patent
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Issued Date -
Jun 3, 2010
app pub date -
Nov 30, 2009
filing date -
Dec 1, 2008
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Abandoned
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Abstract
A paste composition for forming heat-resistant and electrically conductive patterns on substrate by direct printing includes conductive particles, polyamic acid, and solvent. The paste composition can form solderable electric circuits or solderable antenna on substrate, especially on flexible sheets by direct printing to simplify processes, to save time and cost, and to minimize waste.
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