PRODUCTION OF STAMPS, MASKS OR TEMPLATES FOR SEMICONDUCTOR DEVICE MANUFACTURING
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United States of America Patent
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Issued Date -
May 27, 2010
app pub date -
Jan 22, 2008
filing date -
Jul 25, 2007
priority date (Note) -
Abandoned
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Abstract
The invention provides a method of manufacturing a substrate comprising at least two areas with the same or different pattern(s) on the surface of the substrate. The process comprises the steps of providing the substrate applying a layer of a radiation sensitive material on the substrate, recording the pattern(s) on the at least two areas (2a to 2d) in the layer of radiation sensitive material by circularly moving a focused recording spot in one sweep over the entire substrate (1) in the layer of sensitive material by moving a focused laser spot in one sweep over the entire substrate, and developing the layer of sensitive material. The invention further provides a method for manufacturing at least two stamps or masks for manufacturing of semiconductor devices using a mastering process.
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