Heater integrated thermocouple
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
May 20, 2010
app pub date -
Nov 19, 2008
filing date -
Nov 19, 2008
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention discloses a system and method for relieving stresses from a layer deposited on the surface of a functional element used inside a reaction chamber. The system includes a heater which is integrated with the functional element. The heater heats the functional element to a temperature above the wafer processing temperature and independent of the wafer processing temperature in the reaction chamber. The independent heating of the reaction chamber causes cracking of the deposited layer. This relieves the stresses that are developed in the deposited layer and consequently, the functional element is safeguarded from failure.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully