Field emission cathode plate and method for fabricating the same

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United States of America Patent

APP PUB NO 20100123382A1
SERIAL NO

12385890

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Abstract

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A field emission cathode plate is disclosed, which includes: a substrate; a cathode layer, disposed on the substrate; a conductive layer with an arc surface or a resistor layer with an opening and resistivity larger than that of the cathode layer, disposed on the cathode layer; and a cambered field emission layer, having an arc surface and disposed on the conductive layer or on the cathode layer in the opening of the resistor layer and covering the resistor layer around the opening. The present invention also provides a method for fabricating the above-mentioned field emission cathode plate. The method can provide field emission cathode plate achieving uniform field emission and does not involve high resolution and cost.

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Patent Owner(s)

Patent OwnerAddress
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEHSINCHU
TATUNG COMPANYNO 22 CHUNGSHAN N RD 3RD SEC TAIPEI 104

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Ching-Hsuang Taipei, TW 4 3
Chin, Nien-Chun Taipei, TW 2 2
Jeng, Jian-Min Taipei, TW 11 23
Li, Hung-Yuan Taipei, TW 38 128
Yang, Tzung-Han Taipei, TW 22 25

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