Importance

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Abstract

A sensor die in a sensor device includes a conformal dielectric coating over at least a die sidewall adjacent an interconnect edge and, in some devices, a conformal dielectric coating over at least part of the active area of the front side of the die. The sensor die can be connected to circuitry in a support by an electrically conductive material that is applicable in a flowable form, such as a curable electrically conductive polymer, which is applied onto or adjacent the dielectric coating on the die sidewall, and which is cured to complete connection between interconnect pads on the die and exposed sites on the support circuitry. In some devices, a coating over the active area of the sensor die provides mechanical and chemical protection for underlying structures in and on the die. In an image sensor device, for example, the coating over the image sensor array on the die is substantially optically transparent. Also, a package contains such a sensor die mounted on and electrically connected to a support; and assemblies include such a sensor die and additional die mounted on and electrically connected to opposite sides of a support. Also, methods are disclosed for making the sensor die, devices, packages, and assemblies.

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First Claim