Temperature sensor with buffer layer
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United States of America Patent
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Issued Date -
May 13, 2010
app pub date -
Jul 14, 2009
filing date -
Aug 11, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A temperature sensor with a bandgap circuit is provided. The bandgap circuit is covered by a buffer layer of photoresist. The device is packaged in a housing. By providing the buffer layer, mechanical stress in the bandgap circuit, as it is e.g. caused by different thermal expansion coefficients of the packaging and the chip, can be reduced. This improves the accuracy of the device.
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