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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
ARACA INC	2550 EAST RIVER ROAD APT 12204 TUCSON AS 85718

International Classification(s)

• B24B:MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR PO....

• 2008 Application Filing Year
• B24B Class
• 512 Applications Filed
• 341 Patents Issued To-Date
• 66.61 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Borucki, Leonard	Tucson, US	8	40
# of filed Patents : 8 Total Citations : 40
Furukawa, Masanori	Nagano, JP	15	131
# of filed Patents : 15 Total Citations : 131
Ichikawa, Koichiro	Nagano, JP	12	126
# of filed Patents : 12 Total Citations : 126
Philipossian, Ara	Tucson, US	36	607
# of filed Patents : 36 Total Citations : 607

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Patent Citation Ranking

• 2 Citation Count
• B24B Class

• 5.15 % this patent is cited more than
• 15 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2010/0112,905

WAFER HEAD TEMPLATE FOR CHEMICAL MECHANICAL POLISHING AND A METHOD FOR ITS USE

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Abstract

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The present invention is a planar template for a CMP tool polishing head possessing a means of securing a wafer in CMP polishing where the back surface of the template is held to the polishing head by retaining means and a method for using the planar template.

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Description

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Claims

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