RELIABLE INTERCONNECT INTEGRATION
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United States of America Patent
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Issued Date -
May 6, 2010
app pub date -
Nov 5, 2008
filing date -
Nov 5, 2008
priority date (Note) -
Abandoned
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Abstract
A semiconductor device includes a dielectric layer in which an upper portion is densified. An interconnection is disposed in the dielectric layer. The densified portion reduces undercut during subsequent processing, improving reliability of the interconnection.
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