Method and device for tempering electronic components
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United States of America Patent
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Issued Date -
May 6, 2010
app pub date -
Mar 29, 2007
filing date -
Apr 3, 2006
priority date (Note) -
Abandoned
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Abstract
Disclosed are a method and a device for tempering electronic components (5) within a handler (1) for a functional test. The components (5) are initially pre-tempered in a temperature chamber (2) by convecting a gas and are then directly tempered in a conductive manner to the test temperature in a test chamber (3). The gas pressure (P.sub.1) inside the test chamber (3) is greater than the gas pressure (P.sub.2) in the temperature chamber while the gas pressure (P.sub.2) in the temperature chamber (2) is greater than the ambient pressure (P.sub.a). The inlet (4) and outlet (29) of the temperature chamber (2) are alternately opened and closed.
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