Thin Interdigitated backside contact solar cell and manufacturing process thereof
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United States of America Patent
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Issued Date -
May 6, 2010
app pub date -
Oct 31, 2008
filing date -
Oct 31, 2008
priority date (Note) -
Abandoned
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Abstract
regions) is performed while the thin epitaxial layer is attached to the porous layer and substrate. After backside processing, the wafer is clamped and exfoliated. The front of the PV cell is completed from the region of the wafer near the exfoliation fracture layer, with subsequent removal of the porous layer, texturing, passivation and deposition of an antireflective coating. During manufacturing, the cell is always supported by either the bulk wafer or a wafer chuck, with no processing of bare thin PV cells.
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