COPOLYAMIDE, COMPOSITION CONTAINING SUCH COPOLYAMIDE AND USE THEREOF
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United States of America Patent
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Issued Date -
Apr 29, 2010
app pub date -
Feb 15, 2008
filing date -
Feb 16, 2007
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Abandoned
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Abstract
, wherein x is the number of carbon atoms of the diamine and y is the number of carbon atoms of the diacid, the amino acid, each diamine and each diacid being obtained from a renewable raw material according to ASTM D6866 standard. The invention also relates to a composition containing the copolyamide and to the use of this copolyamide and of such a composition, essentially for producing thermofusable glues, in any form thereof.
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