THIN HEAT DISSIPATING APPARATUS

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United States of America Patent

APP PUB NO 20100101763A1
SERIAL NO

12258629

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heat dissipating apparatus includes a heat pipe, a heat dissipating element, and two heat conducting bases. The pipe body of the heat pipe is formed integrally and has two evaporation ends disposed on both distal ends of the pipe body respectively and a condensation section disposed at a portion of the pipe body for installing the heat dissipating element on the condensation section, and the two heat conducting bases are disposed on the two evaporation ends respectively, such that the invention simply requires connecting the heat dissipating element with the single heat pipe to achieve the effect of reducing the volume or space occupied by the heat dissipating element.

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Patent Owner(s)

Patent OwnerAddress
CHAUN-CHOUNG TECHNOLOGY CORPSANCHUNG CITY TAPEI HSIEN

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Meng-Cheng Taipei, TW 22 343
Lin, Shih-Yuan Taipei, TW 21 126

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