WAFER LIFT PINS SUSPENDED AND SUPPORTED AT UNDERSIDE OF SUSCEPTOR
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United States of America Patent
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Issued Date -
Apr 29, 2010
app pub date -
Oct 29, 2008
filing date -
Oct 29, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A wafer lift pin structure for lifting a semiconductor wafer includes: a through-hole penetrating through a susceptor; an upper guide fixedly fitted inside the through-hole, a lift pin constituted by an upper part, a middle part, and a lower part and inserted in the upper guide; and a lower guide attached to the underside surface of the susceptor, wherein the lift pin is suspended from the lower guide at the middle part of the lift pin at the lower position. The middle part has a diameter greater than that of the upper part and that of the lower part, and has a weight heavier than that of the upper part and that of the lower part.
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